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 Industrial & Machinery. Process Equipment.
 

Hitachi S-9300 CD SEM_SDI

 

Condition:

- Fully Refurbished by many years experienced technicians.
- Guaranteed to meet or exceed OEM specifications
- 3 MONTH warranty and specifications guarantee.
- Installation, training, service, and support available worldwide!

Hitachi S-9300 CD SEM_SDI

• Manufacturer: Hitachi
• Wafer Size: 200mm
•Electron Gun: Schottky emission source
• Accelerating voltage: 500V to 1600V, 10V steps
• Probe Current: 4~24pA with automated setting and measurement by Faraday cup
• Electromagnetic Lens: 3 Stage Electromagnetic Lens System with boosting voltage
• Objective Lens: 4 opening click stop, heated aperture is selectable/adjustabl­e outside the vacuum
• Scan Coil: 2-Stage Electromagnetic Deflection
• Astigmatism correction via an 8-pole electromagnetic coil • Magnification = 1000x to >300000x • Field control method ; Continuously on for sample decharging, at all voltages • Wafer imaging ability; Entire surface of 8” (or 12”) wafer
• Depth of focus: >= 1.0um at 80000x magnification
• Resolution: 3nm (800V) Retarding/Boosting­ Mode
• Hitachi Probe Tip Optical Microscope System • Image is Monochrome, using CCD camera • Magnification is 110x • Wafer imaging: X coverage from 5 – 295mm, Y coverage from 5 – 195mm , notch down • Field of View: 1.2mm Workstation • Model: HP B180L (9GB) • O/S: Unix version HP-UX 10.20 or newer • Software version: 14.71 or newer • SECS/GEM Communication Interface
• Dual XY Hitachi Microscale • DSP Image Processing • BSE Mode Functionality • Multipoint Measurement Function • Edge Roughness Function • Automated Image Archiving Function Other
• 200mm Wafer Handling System: (2) Cassette holders/ergo flippers
• Convertible to 300mm with conversion kit BRK-287006300
• Edwards ESDP30 Pump, vib iso and vert inlet/exhaust (subject to availability)

Specifications: from Paul

Model No: S-9300
Wafer Size: 300mm
Electron Optical System: Electron Gun: Schottky emission source
Accelerating Voltage: 500V to 1600V, 10V steps, Probe current: 4~24pA
Electromagnetic Lens: 3-Stage Electromagnetic Lens System with boosting voltage
Objective Lens: 4-opening click stop, heated aperture is selectable/adjustabl­e outside the vacuum
Scan Coil: 2-Stage Electromagnetic Deflection
Magnification = 1000X to > 300,000X
Wafer Imaging Ability: Entire Surface of 12” wafer
Resolution: 3nm (800V)
Y coverage from 5 – 295nm, notch down
Field of view: 1.2mm
Workstation: Model HP B180L (9GB)
O/S: Unix version HP-UX 10.20 or newer
SECS/GEM communication interface
Dual XY Hitachi Microscale
DSP Image Processing
BSE Mode Functionality
Multipoint Measurement Function
Edge Roughness Function


Verified member Peter (Santa Clara, CA)   408-988-5188   Visit website   Send e-mailE-mail     Shipping available    
8.12.2009   #346273   Views:373   Add the ad to "Saved ads"Save the ad   Send e-mail to friends about the classified adTell friends   Abuse report   Forum
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