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Manufacturer:AG Associates

Refurbished by:Allwin21 Corp

Heatpulse is a Registered Trademark of AG Associates.AG Heatpulse 4100 Series are single-wafer, cassette-to-cassette rapid thermal processors, capable of processing in inert or corrosive ambient. The unit is built for the production environment. AG4100 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures.

High-intensity visible radiation heats wafers for short periods. Fast heating and cooling rates unobtainable in conventional technologies.
Consistent wafer-to-wafer process cycle repeatability.
Elimination of external contamination.
Small footprint and energy efficiency.
Wafer Size 4”, 5” and 6” .
Robot control ability. (Equip Tech. robot with one arm)
Single Wafer Process.
Gold coated aluminum chamber with water cooling
Radiation heating lamp module
4-gas channel with 4 MFCs
Cassette to cassette wafer handling
Multiple cycle processing capability
Steady Temp Range: 600°C to 1250°C for pyrometer sensor, 100°C to 600°C for Thermocouple.
Steady state process time 0 to 30000 sec programmable.
Temp Ramp-up Speed: 10°C to 120°C for wafer. Programmable
Ramp down speed 10°C - 150°C for wafer
Robot wafer cycling: 80 Wafers/Hr.

Rapid thermal processing

Rapid thermal processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so they do not break due to thermal shock..Such rapid heating rates are attained by high intensity lamps process. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.

Rapid thermal anneal (RTA) is a process used in semiconductor device fabrication which consists of heating a single wafer at a time in order to affect its electrical properties. Unique heat treatments are designed for different effects. Wafers can be heated in order to activate dopants, change film-to-film or film-to-wafer substrate interfaces, densify deposited films, change states of grown films, repair damage from ion implantation, move dopants or drive dopants from one film into another or from a film into the wafer substrate. Rapid thermal anneals are performed by equipment that heats a single wafer at a time using lamp based heating that a wafer is brought near. Unlike furnace anneals they are short in duration, processing each wafer in several minutes. Rapid thermal anneal is a subset of processes called Rapid Thermal Process (RTP).

AG Associates Heatpulse is one of the most famous RTP equipment manufacturers. Many Integrated Chip companies, R&D centers, Institutes all over the world have been using AG Heatpulse Systems.

Allwin21 Corp can provide the following refurbished RTP equipment

AG Heatpulse 210
AG Heatpulse 410
AG Heatpulse 610
AG Heatpulse 2100
AG Heatpulse 4100
AG Heatpulse 4100S
AG Heatpulse 4108

Please visit our vebsite for the following:

(1)Rapid Thermal Processing in Solar Cell

(2)Rapid Thermal Processing in Light-Emitting Diode

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