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Download Upgraded GaSonic Aura 1000 Technical Documents

Download Upgraded Gasonics Aura 1000 Special Features

GaSonic Aura 1000 Plasma System is the microprocessor controlled down-stream, or “ afterglow” photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. The unit is fully automated, cassette-to-cassette, and is a single-wafer process design.
Combined with Allwin21 Corp advanced Equip Robot transfer wafer technology , AW Control Software and Superior Temperature Control Technology , upgraded Gasonics Aura 1000 provides significant advantages over the original systems.

Use Equip robot wafer transfer instead of the index of the original, which will decrease the down time and low the wafer damage, particles greatly.
Single-wafer process
3”, 4”, 5” and 6” wafer capability
Automatic Equip robot wafer loader / unloader
Infrared heat source for process temperature control
Downstream processing: No wafer radiation damage(<0.1 volt CV shift)
Automatic photo emission type end-point detection
Front and backside resist removal
Pentium PC computer equipped either DOS Windows
Interface control board with parallel connectors between PC computer and the Aura-1000 system
New 16 bits A/D measurement system to replace original 12 bits A/D system to improve the accuracy of the measurements of gas flow, vacuum pressure, EOP, temperature of the wafer, etc. to improve the repeatability of the Asher process.
New 14 bits D/A system to replace original old 8 bits D/A to improve the accuracy of the set point of the vacuum pressure, gas flow, etc.
Add new RTP system to get more accuracy temperature control to improve the repeatability of the process. The new RTP system includes(1)New lamp control system with new special solid-state relay control system. It is similar to the oven control system of the RTP machine;(2)New zero crossing detects system. It is similar to the zero crossing detect of the RTP machine.(3)K-type thermocouple system with vacuum feed-through and amplifier to measure the temperature of the wafer. The thermocouple is touching the backside of the wafer directly. The feed-through is put on the front door, which is good when the wafer heated at 450 degree C.(4)Replace the center lamp of the system to be the same high power as the side one to speed up the heat speed and improve the uniformity of the asher and descum process.
User-friendly recipe editor with gas flow set point, vacuum pressure set point, RF on or off set up, temperature setup etc.
New GUI interface with curves display of the temperature, vacuum pressure, gas flow, RF status, EOP signal etc. during the process.
Saved all process data on the local hard disk and send data to the server if it is needed (option).
Saved all operation function, date, time and error message on the lot file.
Wafer ID reading function to read wafer ID and use the wafer ID for the data ID to save the process data. Data saved with 4 layers: (1) directory (say year 2003,2004), (2) lot ID, (3) Date Time or step ID, (4) wafer ID. So it is easy to trace the data.
Bar code function for the lot ID, recipe ID selection option.
Manual and auto process running
System diagnostics for the quick diagnostic of the system
Easier I/O set and checks function for the Maintenance
RTP function with temperature control ±1~2°C accuracy from 50 to 500°C with K-type thermocouple.
Higher through put.
Advanced accurate temperature control to make much better repeatability
Better uniformity duo to the center lamp has the same power as the side lamp
All process data saved and easier for failure analyzer and process debug
“Exposed” I/O, A/D, D/A is easier for troubleshooting and maintenance.
Tools would be painted and cleaned up
Chamber would be re-anodized
Upgraded GaSonic Aura 1000 Applications
Photoresist Stripping

High dose implant (As+, B+, P+)
Post-polysilicon etch
Post-metal etch
Post-oxide etch
Rework
Controlled Resist Removal

Post-develop descum (pre-etch)
Dry/wet process capability
Resist planarization
Uniformity capability (5% 1s)

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